ASIC Development

Partner with Semiconductor Experts

We develop custom ASICs that transform complex system requirements into optimized silicon, supporting applications across semiconductor manufacturing, photonics, communications, computing, precision instrumentation, and industrial systems. Capabilities include:

  • Custom digital, analog, mixed-signal, and RF ASIC design
  • System architecture, specification, and feasibility studies
  • Low-power, high-performance, and application-optimized designs
  • FPGA prototyping and hardware verification
  • DFT, verification, physical implementation, and tape-out support
  • Packaging, test development, and manufacturing coordination

 

Full-cycle ASIC development

We support the entire development flow, including:

  • System-level architecture and feasibility analysis
  • RTL design and functional verification
  • High-speed digital design optimization
  • Physical design (synthesis, place & route, timing closure)
  • Design for testability (DFT) and manufacturability
  • Silicon validation support and bring-up

 

High-speed ASIC expertise

We have specialized experience in designing ASICs for demanding applications where performance is critical. This includes:

  • High-throughput digital signal processing
  • Low-latency data acquisition systems
  • High-speed serial interfaces and mixed-signal integration
  • Ultra-low-jitter clocking architectures
  • Power-efficient compute architectures

We provide end-to-end ASIC development services, supporting customers from early architecture definition through to silicon-ready implementation. As an engineering partner, we help transform complex system requirements into high-performance, manufacturable integrated circuits. Our team covers both front-end and back-end ASIC development, enabling a seamless flow from specification to physical design. We specialize in high-speed, mixed-signal, and performance-critical ASICs where signal integrity, timing closure, and power efficiency are key design drivers.

Packaging Partner

We work closely with a dedicated packaging partner to ensure seamless transition from ASIC design to fully integrated, production-ready hardware. This collaboration enables us to address the critical interface between chip design and system-level implementation, including advanced packaging strategies, high-frequency interconnects, and thermal management. By combining in-house expertise in photonics, quantum systems, and ultra-low-noise electronics with specialized packaging capabilities, we ensure that each ASIC is optimized not only at the silicon level, but as a complete, high-performance component within real-world optical and electronic systems.

Engineering partnership approach

We integrate directly with your development team, acting as an extension of your engineering capability. This allows faster iteration cycles, tighter system optimization, and reduced risk from concept to tape-out.

Whether you need full ASIC ownership or targeted support in specific design phases, we provide flexible engagement models tailored to project complexity and maturity.